Passive Components White Papers

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Cutting Edge Multicore Development Techniques for the Next Wave of Electronics Products
sponsored by IBM
WHITE PAPER: As more and more software is embedded into both consumer and industrial electronics, the electronics industry is being challenged with ensuring rigor within its software development process, often a new core competency, and the integration of hardware and software. Read this paper to learn about solutions that address these complex challenges.
Posted: 01 Sep 2010 | Published: 19 Mar 2010

IBM

Prepare, predict, pinpoint: HP Operations Analytics
sponsored by Hewlett Packard Enterprise
WHITE PAPER: In this white paper, discover the best way to manage all of this data: by exploiting big data management and analytics. Read on now to learn about one standalone solution that offers the means to collect and analyze huge data volumes from multiple perspectives, and provides tremendous opportunities to IT operations.
Posted: 21 Feb 2014 | Published: 31 Dec 2013

Hewlett Packard Enterprise

FIFO Solutions for Increasing Clock Rates and Data Widths
sponsored by Texas Instruments, Inc.
WHITE PAPER: Steady increases in microprocessor operating frequencies and bus widths over recent years have challenged system designers to find FIFO memories that meet their needs.
Posted: 13 Apr 2000 | Published: 01 Jan 1996

Texas Instruments, Inc.

5 Reasons Environmental Sensors are used in all Modern Data Centers
sponsored by Raritan Inc.
WHITE PAPER: This whitepaper offers five reasons you should consider implementing environmental sensors in your data center.
Posted: 25 Mar 2014 | Published: 25 Mar 2014

Raritan Inc.

Built-in Self-test (BIST) Using Boundary Scan
sponsored by Texas Instruments, Inc.
WHITE PAPER: This document shows how existing architectures can be modified to conform to IEEE 1149.1 architecture.
Posted: 09 May 2000 | Published: 01 Dec 1996

Texas Instruments, Inc.

3D printing: bringing better products to market faster
sponsored by Stratasys, Ltd
WHITE PAPER: Discover how 3D printing can help your organization bring better products to market faster.
Posted: 28 Apr 2014 | Published: 28 Feb 2014

Stratasys, Ltd

Imaging a Latitude 10 on Windows 8 with System Center Configuration Manager
sponsored by DellEMC and Intel®
WHITE PAPER: Check out this exclusive white paper for directions on how to create a Windows 8 image for the Latitude 10, as well as the information you need to image a Latitude 10 in your enterprise environment.
Posted: 07 Mar 2014 | Published: 31 Dec 2010

DellEMC and Intel®

Oracle Exalogic Elastic Cloud: System Overview
sponsored by Oracle Corporation
WHITE PAPER: Read this white paper to learn about Oracle Exalogic Elastic Cloud, an Engineered System consisting of software, firmware, and hardware designed to meet the highest standards of reliability, serviceability and performance.
Posted: 09 Apr 2012 | Published: 15 Sep 2011

Oracle Corporation

PowerEdge M1000e Blade Chassis
sponsored by Dell, Inc. and Intel®
WHITE PAPER: Check out this concise white paper to find out the key features of this blade chassis that will help you construct your IT infrastructure, as well as a complete list of its technical specifications.
Posted: 19 Feb 2014 | Published: 31 Dec 2013

Dell, Inc. and Intel®

Indonesia Stock Exchange halves its hardware investment cost with a Red Hat Solution
sponsored by Red Hat and Intel
WHITE PAPER: This brief whitepaper explains how the Indonesian Stock Exchange (IDX) was able to half its hardware costs by leveraging a Linux system to support trading machines, surveillance machines, database engines, and more.
Posted: 16 Dec 2013 | Published: 16 Dec 2013

Red Hat and Intel