Passive Devices White Papers

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Cutting Edge Multicore Development Techniques for the Next Wave of Electronics Products
sponsored by IBM
WHITE PAPER: As more and more software is embedded into both consumer and industrial electronics, the electronics industry is being challenged with ensuring rigor within its software development process, often a new core competency, and the integration of hardware and software. Read this paper to learn about solutions that address these complex challenges.
Posted: 01 Sep 2010 | Published: 19 Mar 2010

IBM

Prepare, predict, pinpoint: HP Operations Analytics
sponsored by Hewlett Packard Enterprise
WHITE PAPER: In this white paper, discover the best way to manage all of this data: by exploiting big data management and analytics. Read on now to learn about one standalone solution that offers the means to collect and analyze huge data volumes from multiple perspectives, and provides tremendous opportunities to IT operations.
Posted: 21 Feb 2014 | Published: 31 Dec 2013

Hewlett Packard Enterprise

5 Reasons Environmental Sensors are used in all Modern Data Centers
sponsored by Raritan Inc.
WHITE PAPER: This whitepaper offers five reasons you should consider implementing environmental sensors in your data center.
Posted: 25 Mar 2014 | Published: 25 Mar 2014

Raritan Inc.

Built-in Self-test (BIST) Using Boundary Scan
sponsored by Texas Instruments, Inc.
WHITE PAPER: This document shows how existing architectures can be modified to conform to IEEE 1149.1 architecture.
Posted: 09 May 2000 | Published: 01 Dec 1996

Texas Instruments, Inc.

FIFO Solutions for Increasing Clock Rates and Data Widths
sponsored by Texas Instruments, Inc.
WHITE PAPER: Steady increases in microprocessor operating frequencies and bus widths over recent years have challenged system designers to find FIFO memories that meet their needs.
Posted: 13 Apr 2000 | Published: 01 Jan 1996

Texas Instruments, Inc.

Reduce data center complexity when you 'go virtual'
sponsored by HPE and Intel®
WHITE PAPER: Access this exclusive, in-depth resource to find out how HP's latest solution for virtual environments can benefit your organization.
Posted: 04 Mar 2014 | Published: 31 Dec 2013

HPE and Intel®

3D printing: bringing better products to market faster
sponsored by Stratasys, Ltd
WHITE PAPER: Discover how 3D printing can help your organization bring better products to market faster.
Posted: 28 Apr 2014 | Published: 28 Feb 2014

Stratasys, Ltd

HP's latest management solution will help conquer data center challenges
sponsored by HPE and Intel®
WHITE PAPER: Take a look at this exclusive resource to find out how HP's new approach to infrastructure management can help you save time and money when confronting data center challenges.
Posted: 05 Feb 2014 | Published: 31 Oct 2013

HPE and Intel®

Improve Data Center Efficiency with Enterprise Linux Servers
sponsored by SUSE
WHITE PAPER: IT budgets are not expected to recover anytime soon, so companies need to adjust to the reality of using fewer resources to deliver business services. This white paper explains how you can accomplish this seemingly impossible objective by running your critical workloads on Linux.
Posted: 19 Jun 2012 | Published: 01 Mar 2012

SUSE

IBM PureFlex Systems with VMWare: Cloud-ready virtualization with the flexibility of an expert integrated system
sponsored by IBM
WHITE PAPER: This resource explores the benefits of combining IBM PureFlex System with VMware. Inside, discover how you can implement a reliable cloud-ready infrastructure with integrated hardware and software designed for efficient virtualization. Discover if this combination will bring the benefits your organization needs.
Posted: 15 Jul 2013 | Published: 30 Apr 2012

IBM